Electronic Components
GENEVA: Full-Digital Amplifier Family Begins With 4x135W and 4x50W Systems on Chip, Enabling a New Generation of Class-D Car Audio Products
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CHICAGO, IL: Will Be Used to Develop and Fabricate Unique Sensors for Use in Advanced Diagnostic Applications
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HSINCHU, TAIWAN: Award-Winning LED Light Bulb, Solar Panel Design, and Clamp-On Household Appliance Energy Meter Reduce Energy Consumption
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BOSTON, MA: Intelligent LED Lighting One of Many Sustainability-Focused Technologies Implemented in New Construction
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SANTA CLARA, CA: Will Exhibit at TSMC Open Innovation Platform Ecosystem Forum
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SAN JOSE, CA: Will Host Discussion on ideas2silicon Design Services Platform
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GENEVA: Low-Leakage Bypass IC Enhances Power Efficiency and Lowers Cost of Ownership in Safety-Oriented Signage, Vehicle Lamps and Street/Traffic Lighting
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SAN JOSE, CA: Will Host Discussion on ideas2silicon Design Services Platform
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HILLSBORO, OR: Ultra-Low Density FPGA Contends for "Digital Semiconductor Product of the Year"
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SANTA CLARA, CA: Will Exhibit at TSMC Open Innovation Platform Ecosystem Forum
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