Electronic Components
GENEVA: Silicon-Verified Process Technology Delivers 30% Higher Speed and up to 50% Improvement in Power
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SATELLITE BEACH, FL: LSG Continues to Innovate With New Technology and Expanding Patent Portfolio
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HILLSBORO, OR: "Mobile Innovation" Reference Design Enables Image Sensors to Be Used in a Variety of Consumer Applications
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GENEVA: New Vision and Strategy; Focus on Five Growth Drivers Decision to Exit ST-Ericsson After a Transition Period New Financial Model Targeting 10 Percent or More Operating Margin
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SUNNYVALE, CA: HV2809 Reduces PCB Area and Increases System Reliability
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BILLERICA, MA: Recognized for Creating Technology Innovations in Green Technology
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Bückeburg: Bückeburg, 7 December 2012 – At the SPS/IPC/Drives trade fair which ended a few days ago (Nuremberg, 27-29 November), the Swedish Bluetooth specialist connectBlue presented the RBE221s Bluetooth ac ...
MUNICH, GERMANY: Will Present "Push-Button Verification of Power Optimizations for Xilinx FPGAs," Demonstrate Entire Suite of Formal Verification Tools
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HOUSTON, TX: New Certification Confirms Smith's Ability to Meet the Stringent Requirements of the Aerospace Industry
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SANTA CLARA, CA: Experienced Team to Provide Industry-Leading Service and Support to Customers in the Refurbished Electronics Manufacturing Equipment Market
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CROLLES, FRANCE: Highest Honor for Electronics R&D in France Recognizes Work on Next-Generation Semiconductor Process Technology
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ANDOVER, MA: Incorporating ZVS Topology Into a Buck Regulator Dramatically Improves System Performance
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MINNEAPOLIS, MN: Johnstech International's Strong Relationship With Ronald McDonald House Charities Was a Primary Consideration for This Award
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BEAVERTON, OR: Hidden but Heard: New Report Highlights the Impact of Noise in Everyday Life, Whether at Work, at School or at Home
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LIVERMORE, CA: New Packaging System Broadens Array Performance While Reducing the Cost of LED Lighting
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