businesspress24.com - Electronic Components: Pressemitteilungen - Kategorie - Seite 112
 

Electronic Components

Category / Electronics & Semiconductors / Electronic Components


Pericom Expands USB 3.0 Signal Conditioning Family

SAN JOSE, CA: Industry Smallest Footprint and Lowest Power Targets Mobile Devices ...

Thalmic Labs Announces Wearable Gesture Control Device

WATERLOO, ONTARIO: Introducing MYO, the next generation of gesture control that will completely transform how you interact with technology ...

Symmetry to Distribute Valens Semiconductor HDBaseT(TM) Products

HAWTHORNE, CA: Valens Semiconductor Invented HDBaseT(TM) Technology. HDBaseT(TM) Enables video, Audio, Ethernet, Signal Control and up to 100W of Power Transmission Over a Single Cable Thus Creating a Cost Effective ...

Audience Sets New Standard for Mobile Voice Quality With Latest earSmart eS325 Advanced Voice Processor

BARCELONA, SPAIN: Expected to Ship in Devices Within 60 Days, Audience earSmart eS325 Delivers HD Voice, Optimized Speech Recognition, True Three Microphone Support and More ...

COREwafer Industries, Inc. 2012 Results and CEO Update

NEW YORK, NY: The Company Continues to Make Progress Toward Its Goal of Cash Infusion Into Core Wafer Systems ...

OneSpin Solutions to Demonstrate Entire Family of Innovative Formal Assertion-Based Verification Solutions at DVCon 2013

MUNICH, GERMANY: Will Showcase Push-Button Formal Analysis, Automated Assertion Generation, Transaction-Level ABV, Functional Coverage, Equivalence Checking ...

STMicroelectronics Launches Single-Chip Magnetometer, Extending Leading Sensor Portfolio for Mobile and Consumer Applications

GENEVA: High-Performance Magnetometer Completes Range of Magnetic, Acceleration and Gyroscopic Sensors Delivering Ultimate Design Flexibility ...

Microcontrollers From STMicroelectronics Drive Vehicle Safety to Highest Standards

GENEVA: Multi-Core Microcontroller Using In-House Embedded Flash Process Technology Enables Functional Safety Compliance in Automotive Systems ...

NXP Strengthens SmartMX2 Security Chips With PUF Anti-Cloning Technology

EINDHOVEN, THE NETHERLANDS: Licensing Contract With Intrinsic-ID Increases NXP's Security Leadership ...

STMicroelectronics and Soundchip Introduce Components to Create Smart High-Definition Audio Accessories That Dazzle

GENEVA: Powerful New Audio Engines Combined With High-Performance MEMS Microphones Enable Feature-Rich, Software-Controlled Headsets That Take Personal Audio to the Next Level ...

Lattice Semiconductor Names Mark Wadlington Corporate Vice President of World Wide Sales

SAN JOSE, CA: Former Xilinx, LSI Logic Exec Brings Deep Knowledge of Evolving ASIC, FPGA Markets ...


Page 112 von 180:  « ..  111 112 113  114  115  116  117  118  119  120  .. » 180





 

Who is online

All members: 10 565
Register today: 0
Register yesterday: 0
Members online: 0
Guests online: 79


Don't have an account yet? You can create one. As registered user you have some advantages like theme manager, comments configuration and post comments with your name.