Flexible data acquisition through vertical modularity

(PresseBox) - The interaction of sensors, actuators and controls forms the foundation for smart automation in factory environments such as robotics. In order to be able to acquire sensor and machine data flexibly, it is necessary to combine interface diversity and performance in confined space.

ICP Deutschland has achieved this with the new ultra-compact ITG-100-AL Embedded PC through vertical modularity. Equipped with Intelinterfaces or extended mass storage space. Only a few steps are required for this, as the additional housing level is provided with cut-outs for two USB 2.0 and two RS-232 interfaces as well as a 2.5" SATA 6Gb/s SSD drive bay.

Furthermore, a MicroSD and an eMMC 5.0 slot as well as 8-bit digital I/O can be used optionally. The ITG-100-AL can also be extended via the available M.2 and PCIe mini slots. A wireless communication via WLAN and Bluetooth? is also possible installing a M.2 2230-based WLAN module, two RF cables internally and two antennas externally. The extended temperature range from -20

Upon customer request, ICP Deutschland assembles the ITG-100-AL Embedded PC with industrial storage media, expansion cards and led out interfaces as ready-to-use system.

Specifications

Ultra-compact Embedded PC with Intel

Max. 8GB DDR3L SO-DIMM memory

COM, Dual LAN GbE, USB 3.0

Expansions: M.2 and PCIe Mini slots

Optional I/O: eMMC 5.0, MicroSD slot, USB 2.0, COM, 8-Bit digital I/O DIO

VGA with Full-HD resolution

Input voltage: 12VDC

Operating temperature: -20

DIN-Rail or wall mounting

Applications

Smart automation

Data collection

Modular DIN-Rail PC

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Bereitgestellt von Benutzer: PresseBox
Datum: 04.02.2019 - 11:11 Uhr
Sprache: Deutsch
News-ID 1546411
Anzahl Zeichen: 2236

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Reutlingen

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Hazadous Materials Management

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