Electronic Components
SPARKS, NV: Series C investments from Samsung Venture Investment Corp. and leading IDMs and OEMs reflect commitment to Reno's radically better subsystem technologies
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IRVINE, CA: Now Sampling, New Chip Brings 'Zero Power' to DC-DC Applications
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SALEM, NH: Enhanced optical options for wider range of applications
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DRESDEN, GERMANY: Industry Leading Core-chip Technology Expands IDT's RF Solutions in 5G Wireless Infrastructure
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SAN JOSE, CALIFORNIA: Rapid growth of the Qi wireless charging ecosystem demonstrates that wireless power technology has entered mainstream adoption
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SAN JOSE, CALIFORNIA: Newest VCSELs, DML Drivers, and TIAs Demonstrate Ability to Support High-Bandwidth Applications
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LA VERGNE, TN: Light and portable like its namesake, the new machine epitomizes versatility: 70 built-in stitch options and the first SINGER(R) machine equipped with Integrated Even Feed System
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HONG KONG, CHINA: "New Huazhang, New Development, New Dream"; Strives to Offer Professional and All-encompassing Services for Papermaking Industry
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PHOENIX, AZ: Simplifies the Hardware Path from Prototype through to Volume Production
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