ADLINK Launches OSM-MTK510??High-Performance, Ultra-Low Power, Rugged, Compact Solution
OSM-MTK510 Module: A 6-Core, 5W COM Solution Built for Extreme Ruggedness and 10-Year Longevity
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Supports MediaTek Genio 510 for intensive workload, low-power consumption
Offers up to 8GB LPDDR4 RAM and up to 128 GB eMMC, 4K graphics support, 30MP ISP camera, and extensive I/O options.
Built for -40?C to 85?C, with a 10-year lifecycle for long-term mission-critical use.
OSM R1.1 compliant Size-L module
ADLINK Technology Inc., a global leader in edge computing, announces the launch of the new OSM-MTK510. It is an OSM R1.1 Size-L with a 662 BGA module powered by the MediaTek Genio 510 series processor. The newest OSM solution is engineered for efficiency and excels in comprehensive AI workload for real-time decision-making and managing complex data processing.
The OSM-MTK510 is anchored by a powerful 6-core CPU with 2x Arm Cortex-A78 for demanding tasks and 4x Arm Cortex-A55 for ultra-low power consumption, consuming less than 5W, alongside the MediaTek DLA+VPU AI engine, delivering up to 3.2 TOPS to accelerate AI computations that enable real-time intelligent decision-making.
With its integrated Neural Processing Unit (NPU), the OSM-MTK510 drives faster AI model inference and streamlines machine learning tasks with exceptional efficiency. Paired with up to 8GB LPDDR4 RAM and 128GB eMMC to support efficient processing and reliable storage for large datasets and computational AI tasks.
??You will never go wrong with its impressive graphics performance, offering 4K support and a variety of video output options, including HDMI/DP, eDP, and DSI,?" said Henri Parmentier, Senior Product Manager from ADLINK. ??It also integrates ISP cameras with 30MP resolution, perfect for machine learning tasks, vision systems, and real-time image processing. With 1x GbE, USB 3.0, USB 2.0, I2S audio codec interface, and 17x GPIOs, ensuring seamless portability into various applications,?" he added.
Its rugged design optionally supports operating temperatures from -40?C to 85?C, suitable for extreme and high-vibration environments, while its guaranteed 10-year product lifecycle makes it a top choice for mission-critical embedded systems.
The OSM form factor is a compact computer-on-module designed for solderable BGA mini modules, supporting both ARM and x86 designs. At just 45mm x 45mm, these OSM Size-L modules bring exceptional performance in a compact form factor.
Whether processing computation-intensive workloads or powering real-time data, the compact OSM-MTK510 is engineered to deliver exceptional performance, efficiency, and versatility.
Unternehmensinformation / Kurzprofil:
Datum: 18.02.2025 - 03:34 Uhr
Sprache: Deutsch
News-ID 717823
Anzahl Zeichen: 0
contact information:
Contact person: Julie Hübschmann
Town:
Taipei, Taiwan
Phone: +49 (170) 1716313
Kategorie:
Hazadous Materials Management
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