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New Handbook: Thermal management for electronic components

ID: 1544972

Practice-oriented introduction to the cooling of electronics and components

(PresseBox) - Due to the extremely rapid development in all areas of technology, we consider it necessary to re-issue the technical book on ?Thermal management for electronic components? written by Heinrich Cap of SEPA EUROPE. The second edition was comprehensively updated and supplemented and now includes new findings and knowledge relating to state-of-the-art technology.

The volume gives insight into the world of electronics cooling, presents modern ventilation concepts and covers aspects such as noise behaviour and reliability. It provides interesting basic knowledge on active and passive cooling, cooling via heat sinks and much more. Further contents include real-life applications and examples as well as tips for choosing the correct fans.

This indispensable handbook provides the reader with in-depth knowledge of thermal management and is therefore a must-have for all those who require a ready-to-hand extensive guide.



SEPA EUROPE has more than 25 years experience in electronic cooling. We aim at convincing our customers with our extensive product range. This not only includes axial and radial fans but also chip coolers and a wide range of accessories, e.g. finger guards, AC connection cables and dust-proof grids. Our passion for fans is reflected in the development of special customized solutions ranging from ready-for connection, assembled fans with customer-specific lead lengths and connectors, picked goods in sales-oriented packaging to complete customer-specific fans. We offer tailor-made solutions to meet your exact requirements, e.g. fan/heat sink combinations with heat pipes or Peltier elements. We address new challenges and always find the appropriate solution.



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SEPA EUROPE has more than 25 years experience in electronic cooling. We aim at convincing our customers with our extensive product range. This not only includes axial and radial fans but also chip coolers and a wide range of accessories, e.g. finger guards, AC connection cables and dust-proof grids. Our passion for fans is reflected in the development of special customized solutions ranging from ready-for connection, assembled fans with customer-specific lead lengths and connectors, picked goods in sales-oriented packaging to complete customer-specific fans. We offer tailor-made solutions to meet your exact requirements, e.g. fan/heat sink combinations with heat pipes or Peltier elements. We address new challenges and always find the appropriate solution.



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Bereitgestellt von Benutzer: PresseBox
Datum: 12.12.2018 - 06:17 Uhr
Sprache: Deutsch
News-ID 1544972
Anzahl Zeichen: 3743

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Eschbach


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Research & Development


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Diese Pressemitteilung wurde bisher 540 mal aufgerufen.


Die Pressemitteilung mit dem Titel:
"New Handbook: Thermal management for electronic components
"
steht unter der journalistisch-redaktionellen Verantwortung von

SEPA EUROPE GmbH (Nachricht senden)

Beachten Sie bitte die weiteren Informationen zum Haftungsauschluß (gemäß TMG - TeleMedianGesetz) und dem Datenschutz (gemäß der DSGVO).

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