Sidense Webinar on Memory Considerations for the Smart Connected Universe
(firmenpresse) - OTTAWA, ON and SAN JOSE, CA -- (Marketwired) -- 04/28/15 --
Attend the Sidense Webinar on May 6 and learn how your design can benefit from Sidense''s 1T-OTP memory IP.
The Smart Connected Universe comprises a wide range of compute-intensive and connected devices found in a broad range of market segments that include Mobile Computing, IoT, Wearables, Automotive, Industrial and Health. Although diverse in markets, products developed for the Smart Connected Universe are driven by similar requirements for usage, area efficiency, security and low power. One-time programmable (OTP) memory is often the choice in Smart Connected devices for secure code and key storage; analog and sensor trimming and calibration; device configuration; and device IDs.
May 6 at 10AM PDT
Register at:
Sidense Corp. provides very dense, highly reliable and secure non-volatile one-time programmable (OTP) Logic Non-Volatile Memory (LNVM) IP for use in standard-logic CMOS processes. The Company, with over 120 patents granted or pending, licenses OTP memory IP based on its innovative one-transistor 1T-Fuse™ bit cell, which does not require extra masks or process steps to manufacture. Sidense 1T-OTP macros provide a better field-programmable, reliable and cost-effective solution than flash, mask ROM, eFuse and other embedded and off-chip NVM technologies for many code storage, encryption key, analog trimming and device configuration uses.
Over 130 companies, including many of the top fabless semiconductor manufacturers and IDMs, have adopted Sidense 1T-OTP as their NVM solution in more than 400 designs. Customers are realizing outstanding savings in solution cost and power consumption along with better security and reliability for applications ranging from mobile and consumer devices to high-temperature, high-reliability automotive and industrial electronics. The IP is offered at and supported by all top-tier semiconductor foundries and selected IDMs. Sidense is headquartered in Ottawa, Canada with sales offices worldwide. For more information, please visit .
For more information please contact:
Jim Lipman
925-606-1370
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Datum: 28.04.2015 - 07:00 Uhr
Sprache: Deutsch
News-ID 1354588
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Electronic Components
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