MEDIA ALERT: Sidense White Paper Discusses the Use of 1T-OTP Memory for Optimizing Sensor Performance
(firmenpresse) - OTTAWA, ON and SANTA CLARA, CA -- (Marketwired) -- 12/03/13 --
Sidense has released a white paper, "Optimizing Sensor Performance with 1T-OTP Trimming," discussing the advantages of using antifuse-based one-transistor, one-time programmable (1T-OTP) memory to trim sensors.
Variations in component and circuit characteristics, along with chip processing and packaging operations, result in deviations of analog circuits and sensors from their target specifications. To optimize the performance of the systems in which these components are placed, it is necessary to "trim" interface circuitry to match a specific analog circuit or sensor. A 1T-OTP based trimming operation compensates for variations in the analog circuits and sensors due to manufacturing variances of these components.
You can find the white paper on the Sidense website at:
Sidense Corp. provides very dense, highly reliable and secure non-volatile one-time programmable (OTP) Logic Non-Volatile Memory (LNVM) IP for use in standard-logic CMOS processes. The Company, with over 115 patents granted or pending, licenses OTP memory IP based on its innovative one-transistor 1T-Fuse™ bit cell, which does not require extra masks or process steps to manufacture. Sidense 1T-OTP macros provide a better field-programmable, reliable and cost-effective solution than flash, mask ROM, eFuse and other embedded and off-chip NVM technologies for many code storage, encryption key, analog trimming and device configuration uses.
Over 110 companies, including many of the top fabless semiconductor manufacturers and IDMs, have adopted Sidense 1T-OTP as their NVM solution for more than 350 designs. Customers are realizing outstanding savings in solution cost and power consumption along with better security and reliability for applications ranging from mobile and consumer devices to high-temperature, high-reliability automotive and industrial electronics. The IP is offered at and supported by all top-tier semiconductor foundries and selected IDMs. Sidense is headquartered in Ottawa, Canada with sales offices worldwide. For more information, please visit .
Media Contacts:
Susan Cain
Cain Communications for Sidense
Tel: 408-393-4794
Email:
Jim Lipman
Sidense
Tel: 925-606-1370
Email:
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Datum: 03.12.2013 - 14:00 Uhr
Sprache: Deutsch
News-ID 1289042
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