MEDIA ALERT: ProPlus Design Solutions to Showcase Nano-Scale SPICE Modeling to Giga-Scale SPICE Simulation During Symposiums in China and Taiwan
Will Feature Range of FinFET-Ready DFY Products; Dr. Chenming Hu to Keynote China Event
(firmenpresse) - SAN JOSE, CA -- (Marketwired) -- 10/29/13 --
ProPlus Design Solutions, Inc. (), the global leader for SPICE modeling solutions and the leading technology provider for Design-for-Yield (DFY) applications
Will feature its FinFET-ready DFY products that range from nano-scale SPICE modeling to giga-scale SPICE simulations at the 2013 ProPlus Technology Symposiums in Shanghai, China, and Hsinchu City, Taiwan. Dr. Chenming Hu, TSMC distinguished professor of the Graduate School at the University of California, Berkeley, will be the keynote presenter at the Shanghai symposium and offer a perspective on the 3D FinFET transistor he and his team invented.
Tuesday, November 5, from 9:15 a.m. until 5:15 p.m. Registration begins at 8:45 a.m.
Parkyard Hotel, Zhangjiang
Register at:
Thursday, November 7, from 9:15 a.m. until 5:15 p.m. Registration begins at 8:45 a.m.
Ambassador Hotel, Hsinchu
Register at:
The agenda includes presentations on:
9812D, the latest generation wafer-level, 1/f noise measurement system for fast, accurate data collection in the range of 1hertz (Hz) to 10MHz.
FinFET Modeling Solutions with BSIMProPlus™, the leading modeling platform for nanometer devices used by all leading foundries.
NanoSpice™, a next-generation giga-scale high-performance parallel SPICE simulator able to handle 100-million+ element designs, with foundry-validated model accuracy, including FinFET and other advanced nodes.
NanoYield™, a fast, accurate yield versus power, performance, area (PPA) analysis platform for memory, analog and digital designs with High-Sigma Monte Carlo capabilities licensed from and validated by IBM. NanoYield also includes fast process, voltage and temperature (PVT) and fast Monte Carlo applications.
For more information about ProPlus Design Solutions, visit .
ProPlus Design Solutions, Inc. () delivers Electronic Design Automation (EDA) solutions with the mission to enhance the link between design and manufacturing. It is the global leader for SPICE modeling solutions and the leading technology provider for unique Design-for-Yield (DFY) products that integrate the key DFY components advanced device modeling software, a parallel SPICE simulation circuit simulator and hardware-validated statistical variation analysis tools. Products include: BSIMProPlus™/Model Explorer™, a modeling technology platform for nanometer devices; NoisePro™/9812B/9812D, the golden solution for low-frequency 1/f noise and Random Telegraph Signal (RTS) noise characterization and process monitoring; NanoSpice™, a high-capacity, high-performance parallel SPICE simulator for giga-scale circuit simulation; and NanoYield™/NanoExplorer™, a variation analysis platform for yield versus power, performance and area trade-off of memory, analog and digital circuit designs. ProPlus Design Solutions has R&D centers in the San Jose, Calif. and Beijing and Jinan, China, with sales offices in Tokyo, Japan, Hsinchu, Taiwan, and Shanghai, China. More information about ProPlus Design Solutions can be found at .
BSIMProPlus, Model Explorer, NanoExplorer, NanoSpice, NanoYield and NoisePro are registered trademarks of ProPlus Design Solutions. ProPlus Design Solutions acknowledges trademarks or registered trademarks of other organizations for their respective products and services.
For more information, contact:
Nanette Collins
Public Relations for ProPlus Design Solutions
(617) 437-1822
Themen in dieser Pressemitteilung:
Unternehmensinformation / Kurzprofil:
Datum: 29.10.2013 - 03:00 Uhr
Sprache: Deutsch
News-ID 1276830
Anzahl Zeichen: 0
contact information:
Contact person:
Town:
SAN JOSE, CA
Phone:
Kategorie:
Electronic Components
Anmerkungen:
Diese Pressemitteilung wurde bisher 182 mal aufgerufen.
Die Pressemitteilung mit dem Titel:
"MEDIA ALERT: ProPlus Design Solutions to Showcase Nano-Scale SPICE Modeling to Giga-Scale SPICE Simulation During Symposiums in China and Taiwan
"
steht unter der journalistisch-redaktionellen Verantwortung von
ProPlus Design Solutions (Nachricht senden)
Beachten Sie bitte die weiteren Informationen zum Haftungsauschluß (gemäß TMG - TeleMedianGesetz) und dem Datenschutz (gemäß der DSGVO).
