MicroTech to Deliver More Dryers to Major Semiconductor Discrete Manufacturer
Dryer's Ability to Handle Thin Films on Thin Wafers With Minimal Contact or Vibration Is Prime Factor in Sale
(firmenpresse) - FREMONT, CA -- (Marketwire) -- 01/22/13 -- A major semiconductor discrete manufacturer has purchased an additional Surface Tension Gradient Dryer (STGD) from MicroTech because of its ability to dry thin wafers without damage to the wafer's thin films. This is the second order to the manufacturer by MicroTech, a Silicon Valley wet process station supplier.
The 200mm high-aspect ratio wafers utilize tape during processing because the wafers are so thin. The user has reported the following process performance of the STGD:
Zero tape adhesive attack/undercut
Zero tape adhesive residuals at edges of wafers
Minimal contact or vibrations on thin wafers up to 50 micron thickness
Minimal handling contact at load by the Teflon pushup bar fixture, a proprietary mechanism to "float" the wafers during processing.
MicroTech's Surface Tension Gradient Dryer utilizes Marangoni technology. The system uses very small amounts of IPA, approximately 5 ml, which is vaporized above the DI water during the process. The dryer has no moving parts, leaves no watermarks and completely eliminates the DI water from deep trenches and vias. At the end of the cycle, warm N2 dries the wafer cassette.
MicroTech is a leader in the engineering, manufacturing and applications support of wet process and chemical distribution equipment as well as on-site service, repair and maintenance. The company's 20,000 square foot Silicon Valley manufacturing facility is equipped with a Class 100 clean room fully facilitated with DI water and nitrogen for pre-shipment final testing. With over 25 years' experience as a semiconductor equipment manufacturer, MicroTech also supplies the solar, MEMS, LED, BioMed and flat panel display (FPD) markets.
Company Contact:
Craig Story
V.P. Sales and Marketing
510.651.5277 ext. 213
Agency Contact:
Bruce Kirkpatrick
925.244.9100
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Datum: 22.01.2013 - 11:00 Uhr
Sprache: Deutsch
News-ID 1189435
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Electronic Components
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