Mattson Technology Strengthens Foundry Position With Helios XP RTP System Shipment to Fourth Foundry Customer
(firmenpresse) - FREMONT, CA -- (Marketwire) -- 01/07/13 -- Mattson Technology, Inc. (NASDAQ: MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, today announced that it has shipped its Helios® XP rapid thermal processing (RTP) system to a fourth major foundry customer. The Helios XP will be used for the volume production and development of next-generation chips at leading-edge technology nodes.
"At the 2X nanometer and below process regimes, where smaller transistors are more sensitive to temperature variations, achieving uniformity across the die becomes increasingly challenging," said Johannes Keppler, senior director and general manager of Mattson Technology's Thermal Products Group. "The Helios XP's patented dual-side heating and differential thermal energy control (DTEC) technology dynamically controls within-die temperature and reduces pattern loading effect to provide unparallelled temperature uniformity and minimized wafer stress for advanced transistor manufacturing."
Keppler concluded, "Since the introduction of the Helios XP in 2009, the system has been demonstrating its advanced thermal processing capabilities, and the addition of our fourth foundry customer further validates the system's success in addressing their most critical foundry challenges. This latest Helios XP shipment reinforces the strength of our RTP position in the critical foundry area, where we are now positioned at the top four leading semiconductor foundries in the world. We look forward to supporting our foundry customers with technologically advanced tools that deliver excellent thermal processing performance and low cost of ownership to help them achieve the highest yields in their production ramp of next-generation chips."
Mattson Technology, Inc. designs, manufactures and markets semiconductor wafer processing equipment used in the fabrication of integrated circuits. We are a leading supplier of plasma and rapid thermal processing equipment to the global semiconductor industry, and operate in three primary product sectors: Dry Strip, Rapid Thermal Processing and Etch. Through manufacturing and design innovation, we have produced technologically advanced systems that provide productive and cost-effective solutions for customers fabricating current- and next-generation semiconductor devices. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, CA, 94538. Telephone: (800) MATTSON / (510) 657-5900. Internet: .
" This news release contains forward-looking statements. All statements other than statements of historical fact are statements that could be deemed forward-looking statements, including but not limited to statements of the plans, strategies and objectives of management for future operations. Forward-looking statements address matters that are subject to a number of risks and uncertainties that can cause actual results to differ materially from those expressed or implied by such forward-looking statements and assumptions. Such risks and uncertainties include, but are not limited to: macroeconomic and geopolitical trends and events; end-user demand for semiconductors; customer demand for semiconductor manufacturing equipment; the timing of significant customer orders for the Company's products; customer acceptance of delivered products and the Company's ability to collect amounts due upon shipment and upon acceptance; the Company's ability to timely manufacture, deliver and support ordered products; the Company's ability to bring new products to market and to gain market share with such products; customer rate of adoption of new technologies; risks inherent in the development of complex technology; the timing and competitiveness of new product releases by the Company's competitors; the Company's ability to align its cost structure with market conditions; and other risks and uncertainties described in the Company's Forms 10-K, 10-Q and other filings with the Securities and Exchange Commission. The Company assumes no obligation to update the information provided in this news release.
Lauren Vu
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J. Michael Dodson
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Datum: 07.01.2013 - 05:30 Uhr
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