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Vicor to Highlight New Power Semiconductor and System Innovation at Darnell's Power Forum 2012

ID: 1150780

Platinum Event Sponsor Vicor to Exhibit at Premier Power Electronics Industry Conference and Deliver Presentation on Its New ZVS Buck Regulator Architecture

(firmenpresse) - ANDOVER, MA -- (Marketwire) -- 09/13/12 -- Vicor™ Corporation (NASDAQ: VICR) today announced its participation in Darnell's Power Forum 2012, the premier power electronics industry event hosted by Darnell Group. A Platinum sponsor of the event, Vicor will be exhibiting at booth #303 onsite within the DoubleTree by Hilton Hotel, San Jose, California, September 19-21.

At the event, principal engineer Chris R. Swartz will deliver a presentation on a new zero voltage switching (ZVS) buck regulator topology, utilized in the new Picor® Cool-Power® ZVS buck regulators. The presentation, titled 'ZVS Buck Regulator Enables High Performance within Point of Load Applications,' is scheduled for Friday, September 21, from 10:45AM - 12:15PM, and will address the inherent benefits of a ZVS buck regulator topology for board-level designers seeking maximum power density and flexibility for high efficiency point of load DC-DC regulation.

Vicor will be showcasing its newest power semiconductor solutions and systems at the event. In addition to its ZVS buck regulators, the company will feature its new Westcor™ MicroPAC™ output-configurable AC-DC power systems, providing up to 1300 W of continuous power at up to 92% efficiency and 25 Win3 power density for distributed power architectures in industrial and automation, MIL-COTS, telecom and renewable energy applications.

Vicor will also feature its direct 48V-to-processor power conversion solutions for the datacenter, cloud computing and telecom markets. Compliant with Intel's x86 VR12.0 voltage regulation specification, VI Chip® PRM® non-isolated regulators and VTM® current multipliers enable more efficient power distribution and eliminate duplicate conversion stages in traditional 48V to 12V to 1V power systems, yielding more than 5% greater overall efficiency in a package size 3X smaller than competing offerings.

Darnell's Power Forum is a premier international event focused on 'advancing power technologies that matter' for the successful development of next-generation power systems. Presentations and discussions will focus on power management, energy efficiency, advanced components, energy storage, and smart grid innovations that are enabling practical advances in power electronics. For more information visit





Attendees can visit Vicor onsite at Darnell's Power Forum at booth #303. To register to attend the event, please visit

Headquartered in Andover, Massachusetts, Vicor Corporation designs, manufactures and markets innovative, high performance modular power components, from bricks to semiconductor-centric solutions, to enable customers to efficiently convert and manage power from the wall plug to the point-of-load. Complementing an extensive portfolio of patented innovations in power conversion and power distribution with significant application development expertise, Vicor offers comprehensive product lines addressing a broad range of power conversion and management requirements across all power distribution architectures, including CPA, DPA, IBA, FPA™ and CBA. Vicor focuses on solutions for performance-critical applications in the following markets: enterprise and high performance computing, telecommunications and network infrastructure, industrial equipment and automation, vehicles and transportation and aerospace and defense electronics.

Vicor, Picor, Cool-Power, Westcor, MicroPAC, VI Chip, PRM, VTM and FPA are trademarks of Vicor Corporation.



Contact:
Iris Kimber
Vicor Corporation
978-749-3396


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Bereitgestellt von Benutzer: MARKETWIRE
Datum: 13.09.2012 - 07:00 Uhr
Sprache: Deutsch
News-ID 1150780
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