ALLVIA to Sponsor and Exhibit Silicon Interposers at Packaging Conference ECTC 2012 in San Diego
(firmenpresse) - SUNNYVALE, CA -- (Marketwire) -- 05/29/12 -- ALLVIA, the first through-silicon via (TSV) foundry, will sponsor ECTC (Electronic Components and Technology Conference) and display its latest analysis on silicon interposers and embedded capacitors. The 62nd ECTC conference takes place May 29 to June 1, 2012, at the Sheraton Hotel and Marina in San Diego, California. ALLVIA will discuss its current data results at its booth in the adjacent exhibit hall.
Silicon interposers are being used in 3D stacked assembly applications for an increasing variety of reasons, such as reduced costs. The inclusion of an interposer opens up the option of fabricating capacitors closer to the devices they need to protect. ALLVIA has recently presented results of tests and developments they have completed on planar and trench capacitors on interposers. Test results up to 6 GHz have been detailed along with reliability results.
Thin film capacitors without TSVs have been used previously. However, with the interconnect inductance being high, benefits of thin film capacitors have not been fully realized. TSV interposers with embedded capacitors provide the shortest electrical path between devices and power supply decoupling capacitors. TSVs with their very low inductance interconnects thus will enable very high electrical performance when integrated with embedded thin film capacitors.
This year's packaging technology conference will have 39 technical sessions, 16 professional development courses, a panel discussion, a plenary session, a CPMT Seminar, and a technology corner for exhibitors. Registration is open online at .
Located in Silicon Valley, ALLVIA is the first through-silicon via (TSV) foundry and introduced the term "through-silicon via" in both a 1997 business plan and a January 2000 technical article. With the full spectrum of facilities, IP and equipment, ALLVIA offers services for prototyping and full volume production of both front side and back side TSVs to the MEMS and semiconductor industries as well as silicon etching, copper plating, photolithography, CMP, etc
ALLVIA, Inc.
657 N. Pastoria Ave.
Sunnyvale, CA 94085 USA
ph.: 408-720-3333
Bruce Kirkpatrick
925.244.9100
Themen in dieser Pressemitteilung:
Unternehmensinformation / Kurzprofil:
Datum: 29.05.2012 - 10:46 Uhr
Sprache: Deutsch
News-ID 1118776
Anzahl Zeichen: 0
contact information:
Contact person:
Town:
SUNNYVALE, CA
Phone:
Kategorie:
Micro-electronics & Nanotechnology
Anmerkungen:
Diese Pressemitteilung wurde bisher 145 mal aufgerufen.
Die Pressemitteilung mit dem Titel:
"ALLVIA to Sponsor and Exhibit Silicon Interposers at Packaging Conference ECTC 2012 in San Diego
"
steht unter der journalistisch-redaktionellen Verantwortung von
ALLVIA (Nachricht senden)
Beachten Sie bitte die weiteren Informationen zum Haftungsauschluß (gemäß TMG - TeleMedianGesetz) und dem Datenschutz (gemäß der DSGVO).
