Methode Electronics Power Solutions Group to Exhibit at Applied Power Electronics Conference February 5 to 9
(firmenpresse) - ROLLING MEADOWS, IL -- (Marketwire) -- 01/17/12 -- , a division of Methode Electronics, Inc. (NYSE: MEI), today announced it will exhibit at the upcoming Applied Power Electronics Conference (APEC) held February 5 to 9, 2012, in Orlando, Florida. APEC focuses on practical and applied aspects of the power electronics business and includes manufacturing, design, development, marketing and compliance information and products from leaders in the industry.
Methode Power Solutions Group will have a significant presence at APEC this year with an emphasis on its industry leading power technologies, products and a global manufacturing footprint. With in-house capabilities that include powder coating, plating, machining, forming, assembly, manufacture and testing, the group offers customers across a wide range of industries a single vendor to meet all their power requirements with the highest level of quality.
Highlighted in the exhibit booth this year will be four primary product and technology exhibits including interactive demonstration areas.
Components and sub-systems:
Laminated, machined, powder coated and plated bus bars
Extremely flexible high current power cable and assemblies
High current low mV drop, low insertion force power contacts and connectors
Thermal management (liquid chill plates, heat sinks)
PowerRail™ - modular, pluggable high current carrying interconnect system
J1772 SAE Level 1,2; UL approved charge connector and cable harness
Power Electronics Systems
High voltage power and control electronics design, development and manufacturing
On-Board Charger Modules (OBCM) from 5kW through 50kW
Inverger®- Integrated, Bi-Directional Inverter Charger, 7.2kW
Battery Disconnect (BDU) and Power Distribution (PDU) units
Battery management systems; hardware and software communications
Stationary storage systems: Lithium Ion cell technology
Strategic Partner Capabilities
UPE heavy and extreme heavy copper PCB's, integrated signal and power electronic circuits
SBE Power Ring Film Capacitors™, which provide the highest possible ripple current per capacitance for DC link applications.
Product integration design and manufacturing
Complete power systems for charging to and from grid or home and auxiliary equipment
Power storage systems using latest Lithium Ion cell technology
Integrated bus bar, capacitor and IGBT modules for next generation inverter topologies
Visit the Methode Power Solutions Group booths 301,303,305, 400, 402,404 at APEC 2012, Walt Disney World Resort, February 5 to 9, 2012. For more information about the conference, please visit .
Methode Electronics, Inc. (NYSE: MEI) is a global developer of custom engineered and application specific products and solutions with manufacturing, design and testing facilities in China, Germany, India, Lebanon, Malta, Mexico, the Philippines, Singapore, Switzerland, the United Kingdom and the United States. We design, manufacture and market devices employing electrical, electronic, wireless, safety radio remote control, sensing and optical technologies to control and convey signals through sensors, interconnections and controls. Our business is managed on a segment basis, with those segments being Automotive, Interconnect, Power Products and Other. Our components are in the primary end markets of the automobile, computer, information processing and networking equipment, voice and data communication systems, consumer electronics, appliances, aerospace vehicles and industrial equipment industries. Further information can be found on Methode's Web site .
Cecilia Ostberg
708-856-6711
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Datum: 17.01.2012 - 07:00 Uhr
Sprache: Deutsch
News-ID 1073380
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