Technic to Launch New Line of Process Chemistries for Reduced Gold Consumption in Electronic Applications
(firmenpresse) - CRANSTON, RI -- (Marketwire) -- 12/05/11 -- Technic Inc. has announced entering into the final phase of development on enabling technologies designed to reduce the use of gold in electronic packaging and connector applications. The new line of products will be marketed under the name and consists of equipment, electroplating chemistry, and ancillary process chemistries. The technology encompasses newly developed barrier layers for improved component performance, gold replacement technology, and post-treatment processes aimed at further reducing gold consumption. The product line will offer measurable gold reduction without sacrificing the quality of the resultant finishes and be applicable to a wide variety of applications. It is expected that the first products will be released as soon as December 2011 with further releases occurring in early 2012.
"With gold at record valuations, the demand for gold conservation in the electronics industry is intense. With Technic's Gold Reduction Technology, we are creating an integrated portfolio of technically advanced products that enable low-cost finishes for electronic devices without compromise to the integrity or quality of our customers' products."
- Rob Schetty, VP, Technic Advanced Technology Division
Register to receive Gold Reduction Technology product releases as they become available at .
Technic, Inc. is a US based, private, financially strong corporation. For over 65 years, Technic has been a global supplier of specialty chemicals, custom finishing equipment, engineered powders, and analytical control systems to the electronic component, printed circuit board, semiconductor, photovoltaic, industrial finishing and decorative industries.
For information on Technic & Technic products go to: or contact Technic at (401) 781-6100.
Press release contact:
Bob Sheeran
Technic Inc.
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Datum: 05.12.2011 - 01:00 Uhr
Sprache: Deutsch
News-ID 1062839
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Electronics & Communications
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