MEDIA ALERT: TSMC and eSilicon to Exhibit at ChipEXPO in Moscow, November 1-3
(firmenpresse) - SUNNYVALE, CA -- (Marketwire) -- 10/25/11 --
TSMC and eSilicon will exhibit at ChipEXPO, Russia's leading microelectronics exhibition and conference.
November 1-3, 2011
Booth #79, Moscow Expocentre, Moscow, Russia
TSMC and eSilicon
For more information on the conference or to obtain a complimentary ticket:
ChipEXPO
TSMC and eSilicon look forward to talking with customers, partners and industry leaders at this important conference.
TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology and the foundry's largest portfolio of process-proven libraries, IPs, design tools and reference flows. The Company's managed capacity in 2010 totaled 11.33 million (8-inch equivalent) wafers, including capacity from Three advanced 12-inch GIGAFAB™ facilities, four eight-inch fabs, one six-inch fab, as well as TSMC's wholly owned subsidiaries, WaferTech and TSMC China, and its joint venture fab, SSMC. TSMC is the first foundry to provide 28nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please visit .
eSilicon, the largest independent semiconductor VCP, delivers ASICs to OEMs and fabless semiconductor companies through a fast, flexible, lower-risk path to volume production by deploying its comprehensive suite of design-through-manufacturing services and custom IP offerings. eSilicon serves a wide variety of markets including the communications, computer, consumer and industrial segments.
eSilicon -- Enabling Your Silicon Success™
eSilicon and the eSilicon logo are registered trademarks, and Enabling Your Silicon Success is a trademark, of eSilicon Corporation. Other trademarks are the property of their respective owners.
Susan Cain
Cain Communications
503-538-2747
Sally Slemons
eSilicon Corporation
408-616-4695
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Datum: 25.10.2011 - 07:00 Uhr
Sprache: Deutsch
News-ID 1049471
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Micro-electronics & Nanotechnology
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