QuickLogic Delivers Power-Efficient Connectivity Between Qualcomm Modem Chipset and Application Processors
(firmenpresse) - SUNNYVALE, CA -- (Marketwire) -- 10/05/11 -- QuickLogic Corporation (NASDAQ: QUIK)
Enables application processors with SDIO interface to connect to Qualcomm modem chipset with EBI2 interface
Provides low-cost, low-power alternative to USB-based interfaces
QuickLogic Corporation (NASDAQ: QUIK), the leader in low power Customer Specific Standard Products (), today announced the availability of a new application solution for the PolarPro® platform family which connects the SDIO port(s) on application processors to the EBI2 interface found on Qualcomm modem chipsets. This new application solution gives mobile and handheld device designers a low-cost, lower-power, and easy-to-use alternative to common interfaces such as USB ports.
Many mobile device architectures utilize a PHY-based USB for device-to-device connectivity, including application processor-to-cellular modem chipsets. The SDIO interface is a lower power, lower cost solution that requires less software overhead than the PHY-based USB ports which consume more power than necessary to support device-to-device connectivity. QuickLogic's new application solution enables the use of SDIO ports on application processors, from companies such as Freescale, Marvell, MediaTek, NVIDIA and Texas Instruments to connect to the EBI2 interface of Qualcomm's modem chipsets. QuickLogic also provides the software drivers that enable the solution to work with the Linux OS.
"The SDIO to EBI2 client application solution was developed based on strong market demand to connect application processors directly to Qualcomm modem chipsets via a non-USB interface," said Mehul Kochar, senior business development manager for QuickLogic. "Today's mobile device designers must always take into consideration cost, power consumption and ease of use in order to stay competitive. As SDIO interfaces gain in popularity, designers need flexible connectivity solutions that facilitate the design process and enhance the user experience."
The SDIO to EBI2 client application solution is available immediately. It can be implemented in PolarPro devices, which are available today in packages as small as the 3.25mm x 3.49mm WLCSP. For more information on QuickLogic's CSSP capabilities and platforms, please visit
QuickLogic Corporation is the inventor and pioneer of innovative, customizable semiconductor solutions for mobile and portable electronics OEMs and ODMs. These silicon plus software solutions are called Customer Specific Standard Products (CSSPs). CSSPs enable our customers to bring their products to market more quickly and remain in the market longer, with the low power, cost and size demanded by the mobile and portable electronics market. For more information about QuickLogic and CSSPs, visit
QuickLogic and PolarPro are registered trademarks and the QuickLogic logo is a trademark of QuickLogic Corporation. All other brands or trademarks are the property of their respective holders and should be treated as such.
Code: Quick-G
Contact:
Andrea Vedanayagam
Veda Communications
(408) 656-4494
Themen in dieser Pressemitteilung:
Unternehmensinformation / Kurzprofil:
Datum: 05.10.2011 - 15:30 Uhr
Sprache: Deutsch
News-ID 1043069
Anzahl Zeichen: 0
contact information:
Contact person:
Town:
SUNNYVALE, CA
Phone:
Kategorie:
Semiconductors
Anmerkungen:
Diese Pressemitteilung wurde bisher 160 mal aufgerufen.
Die Pressemitteilung mit dem Titel:
"QuickLogic Delivers Power-Efficient Connectivity Between Qualcomm Modem Chipset and Application Processors
"
steht unter der journalistisch-redaktionellen Verantwortung von
QuickLogic Corporation (Nachricht senden)
Beachten Sie bitte die weiteren Informationen zum Haftungsauschluß (gemäß TMG - TeleMedianGesetz) und dem Datenschutz (gemäß der DSGVO).
