Palomar Technologies Discusses Pulsed Heat Eutectic Solder and Chain Wire Bonding for HB LEDs at IMAPS 2011
(firmenpresse) - CARLSBAD, CA -- (Marketwire) -- 10/04/11 -- , the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it will exhibit at IMAPS 2011 in Long Beach, California on October 11-13, in booth #231.
Palomar Technologies is presenting two HB LED technical papers in the Advanced Technologies Track at IMAPS 2011. Palomar Assembly Servicesâ„¢ general manager, , has co-authored "" and "," Beck will be on-site at IMAPS to discuss recent advancements in the LED industry.
"Today's HB LED applications require maximum thermal transfer to achieve performance results. Precision eutectic soldering provides high-quality, low-risk performance," stated Beck. "Reaching performance and cost targets requires continuous improvements in LED devices and packaging designs. Close LED proximity is one of several paths that help to extract every possible lumen per watt. This is best achieved using a pulsed heat eutectic die attach and chain wire bonding."
Palomar Technologies offers a (PHS), designed especially for the ultra-flexible . The PHS allows for a tightly controlled reflow, resulting in a stronger eutectic die bond without voiding. Computer-controlled software provides a highly regulated temperature profile and data feedback throughout the process.
Chain bonding has become a reliable and cost-effective alternative to wedge bonding. Using ball bond technology on the high-reliability , chain bonding follows a ball-loop-stitch-loop-stitch process, producing "chains" of loop shapes traditionally generated by a wedge bonder. Wedge emulation with a ball bonder using chain bonding can be an excellent alternative to using a wedge bonder to perform interconnects. To learn more, download "" technical paper.
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit .
Jessica Sylvester
Marketing Communications
Palomar Technologies
+1 (760) 931-3681
Themen in dieser Pressemitteilung:
Unternehmensinformation / Kurzprofil:
Datum: 04.10.2011 - 08:00 Uhr
Sprache: Deutsch
News-ID 1042339
Anzahl Zeichen: 0
contact information:
Contact person:
Town:
CARLSBAD, CA
Phone:
Kategorie:
Electronics & Communications
Anmerkungen:
Diese Pressemitteilung wurde bisher 124 mal aufgerufen.
Die Pressemitteilung mit dem Titel:
"Palomar Technologies Discusses Pulsed Heat Eutectic Solder and Chain Wire Bonding for HB LEDs at IMAPS 2011
"
steht unter der journalistisch-redaktionellen Verantwortung von
Palomar Technologies (Nachricht senden)
Beachten Sie bitte die weiteren Informationen zum Haftungsauschluß (gemäß TMG - TeleMedianGesetz) und dem Datenschutz (gemäß der DSGVO).
