Electronics & Semiconductors
Category / Electronics & Semiconductors
Lincoln: OCT3032 low power SoCs provide the highest processing capacity per watt for small cell designs with 2G to 5G flexibility
MONTREAL, Canada, 26 February, 2019 – Octasic, the leader in low power wir ...
Lincoln: UltraDevelop 2 embedded analytics software suite beta testing now
EMBEDDED WORLD, NÜRNBERG, GERMANY and CAMBRIDGE, UK – 26 February 2019 UltraSoC today announced that its UltraDevelop 2 integrat ...
Hong Kong: Forges Strategic Alliance, Accelerates Penetration into Gaming Market
HONG KONG, Feb 20, 2019 - (ACN Newswire) - Leyou Technologies Holdings Limited ("Leyou Technologies", and its subsidi ...
Lincoln: Cambridge, UK – 19 February 2019 - UltraSoC, the leading provider of embedded analytics IP and software, today announced the appointment of Redtree Solutions as its technical sales representative in ...
Chennai, India: Chennai, India, Feb 13, 2019 - (ACN Newswire) - Pelabuhan Tanjung Pelepas Sdn Bhd (PTP), a member of MMC Group has sealed an agreement with Ramco Systems (Ramco) to upgrade the port's current Ent ...
Berlin: LUM supports NanoCarbon Conference 2019
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: ERICH JAEGER presents the High-Speed Interface (HSI) data connector as a design study of a connector system for the data transmission between trailer and towing vehicle.
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SEOUL, KOREA: SEOUL, KOREA, Jan 18, 2019 - (ACN Newswire) - Suprema is set to showcase its latest facial recognition technology, biometric-driven enterprise access control and industry leading-fingerprint identific ...
Ludwigshafen: The HF Mid-Range M500 is a new integrated module and extends our proven embedded module series.
The module is small and compact, with dimensions of only 10.95 × 6.0 × 1.7 cm. The integrated SMA ant ...
Jerusalem: Aiming at a service which prevents dementia and enables a society of healthy longevity
Jerusalem, Jan 16, 2019 - (JCN Newswire) - OKI and ARC Innovation Center at Sheba (Sheba), the largest medical ...
Lincoln: • Now supporting embedded systems designers at every stage of the software lifecycle ...
Zurich/Switzerland: Swiss textile innovator HeiQ launches HeiQ XReflex? a radiant barrier technology on high performance fabrics to create warmth without bulk and allow the user to ?Wear Less in Winter®?
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SEOUL, KOREA: SEOUL, KOREA, Jan 14, 2019 - (ACN Newswire) - Suprema, a global leader in biometrics and ID solutions, announced that the company has entered into a commercial software license and distribution agreem ...
Pfinztal: Development of "Smart Materials" for the construction sector
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Pfinztal: Possibilities for the thermal insulation of building facades with foamed polymers
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Redwood City, California / Hilden, Germany: Enhancing QIAGEN's industry-leading position with access to MarkerMine database and real-world evidence insights that provide insights for targeted therapy options
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