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Research & Development

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Han-Modular® Twin: Angular housing ideal for motor connection

Espelkamp: Can reduce production down-time considerably ...

Han® 3A connectors: up to 25 percent wider cable diameters now possible

Espelkamp: New housing components feature a narrow external geometry overall ...

Ha-VIS RFID RF-R300: Highly flexible tailored customer solution

Espelkamp: Software virtualisation concept derived from the MICA open modular platform ...

New 3D technologies

Aarbergen: 3D MID layout software and 3D MID prototype production ...

Schneller Einstieg in die Anforderungen aus der Gruppe 700 der DIN VDE 0100!

Berlin: Immer wenn es um die Errichtung von Niederspannungsanlagen, speziell um die Anforderungen für Betriebsstätten, Räume und Anlagen besonderer Art geht, können Errichter, Installateure und Elektrofac ...

Han-Power® T: Rapid network expansion with 3xPushPull Power

Espelkamp: Sensors to be linked to the periphery of industrial production processes securely ...

preLink®: New termination block for PROFINET applications

Espelkamp: Wire assignment is clear / Assembly is quick and easy ...

Product News electronica 2016

Lippstadt: CONEC junction system Typ S, M, L? the flexible solution for agricultural technology! ...

Reliable and proven? a true classic in High Voltage

Hallbergmoos: Series-S, 10 to 40 kVDC / 30 A from GES Electronic&Service ...

Automation 4.0: Flexible, scalable, ready for networking

Nürnberg: Baumüller shows new solutions and components at SPS IPC Drives 2016 ...

electronica 2016: 50 years knitter-switch

Baldham: Meet knitter-switch in Hall B5 at Booth 273 Go on a journey through time with us ...

Outstanding connections

Mühldorf: ODU presents its new ODU-MAC portfolio and an extensive range of solutions? at SPS IPC Drives 2016, hall 10, booth 330 ...

Intelligent complete solutions for plastic and rubber processing machines

Nuremberg: Baumüller presents sustainable systems, components and services for the plastics industry at K 2016 ...

TAIYO YUDEN Achieves the Industry?s Largest Capacitance with its Low-Profile Ceramic Capacitors

Tokyo: Suitable for Small and Thin Mobile Devices with a Capacitance of 0.47?F and the World's Thinnest Profile of 0.11 mm ...


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